What is 3D IC technology?

Technology advancement in the electronic world has seen electronic components and devices vary in different sizes as the day passes.  

A typical and easy-to-use example of this is the Television set. The earlier set of the television was known for being sizeable, with a noticeable curve behind due to the firing process of electrons on the phosphorescent monochrome display in the Cathode Ray Tube [CRT]. Modern-day television set has seen electronic devices simplified from bulky electronic components into Integrated Circuits [IC] which have us enjoy watching our Plasma or LED [Light Emitting Diode] television which by the way has a striking semblance to a wall frame. Again, technology won this feat. 

Today’s article will be guided on the technology, but more importantly the migration to 3D IC technology. I will urge you to please read through, as you are certain to learn something new. 

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 An IC is an acronym for Integrated Circuit. The Integrated circuit is a unit of electronic components in which small active and passive devices are coupled on a thin substrate of semiconductor material, often silicon. 

The resultant circuit from the composition of these miniature devices is a compact chip that is programmed with a set of instructions to do jobs far better than an array of sizeable components.  

Another name for the IC is the microchip, chip, or electronic circuit. 

IC technology is the specialization in deploying interconnected semiconductors in a circuit into a miniature chip device to execute specific tasks in an electronic system. 

The IC technology has been widely accepted since they are compatible to fit into compact architectures which finds use in various industry depending on its purpose. 

A semi-conductor is a solid substance with conductivity properties that sit somewhere between those of a conductor and that of an insulator. 

The 3D Semiconductor is best described by Wikipedia as a three-dimensional integrated circuit made up of MOS (Metal-oxide-Semiconductor) integrated circuits interconnected vertically using, for example, through-silicon vias (TSVs) or Cu-Cu connections to behave as a single device and achieve performance improvements at lower power and smaller footprint than traditional two-dimensional processes.

Three-dimensional (3D) semiconductor packaging is an advanced semiconductor chip packaging method in which two or more layers of active electronic components are layered and linked vertically and horizontally to form a device.

First of all, SIC means Stacked Integrated Circuits. It is the incorporation of ICs and dies being stacked while interconnecting them with TSV [Through Silicon Vias]  

Just for a better grasp, the vertical electrical connections that flow entirely through a silicon interposer or a die loaded with copper, tungsten, or polysilicon are known as TSVs. 

The 3D SIC is often used interchangeably with 3D IC. 

While Kilby's application was still being reviewed, the first patent for an integrated circuit was issued to Robert Noyce on April 25, 1961. In the 1980s, Japan developed the first 3D IC stacked chips using the through-silicon via (TSV) technique. Hitachi filed a patent in Japan in 1983, followed by Fujitsu in 1984.

The 3D chips have found major use in today’s technology, and most of them are just around you as well. 

 Take, for instance, the 3 D chips are deployed were deployed in console games such as the PSP [Play Station Portable] far back in 2004 before we observed its introduction into the streams of businesses where Toshiba amongst others took enough credits for the inventions. 

The Integrated Circuit invention has done enough good for technology as a whole. Among the numerous features are: 

1. It is compact. 

2. Building its circuitry is neater and easy to trace. 

3. The ICs are affordable. 

4. The ICs are more reliable and tend to serve longer than the common semiconductors and other electronic components. 

5. It can withstand extreme temperatures. 

6. It consumes minimal power. 

7. It has an increased processing speed. 

Integrated Circuits are quite essential in today’s place technology. More vivid than none has the use of integrated circuits is of importance compared to the joining of discrete components. 

Remember the second paragraph addressing how we managed to move from the bulky television set to almost a wall frame television? This is the major importance of the Integrated Circuit to the modern-day man. 

 

For other related information on IC, 3D IC, Semiconductors, SIC, TSV, and other IC technology, you can be sure to get them all at The Watchtower - Web Design Agency Dubai.